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The Samsung Galaxy S4 Exposed; Teardown Analysis

Posted In News, Reviews - By AndroidPress on Thursday, April 25th, 2013 With No Comments »

13.03.14-Galaxy_S4

A major device launch wouldn’t be complete without the device in question being ripped and torn apart, all of it pieces being put on the laboratory table to be inspected and judged like a frog in a science class. The Samsung Galaxy S4 does not get a pass in this respect and the folks at Chipworks have given the S4 the full teardown experience for the mobile device exhibitionist in all of us.

The particular version of the S4 they were able to get a hold of to examine was the GT I9500 from Latin American however there isn’t much reason to believe there would be any meaningful deviations in other variations of the S4.

On the Aesthetic front they say the GS4 is relatively indistinguishable from the GS3 but it raises the bar when it come to specs. Specific features they outline are:

  • 1920×1080 Super AMOLED 5″ diagonal
  • 13 MP primary camera with a 2 MP secondary camera
  • Samsung Exynos 5 Octa 5410 Processor with PowerVR SGX 544MP3
  • The host of wireless standards up to and including 802.11ac
  • Pressure, Temperature and Humidity Sensor
  • Android Jelly Bean

Of some note is the GS4’s use of Samsung made components, this is always welcome as there is a greater certainty that the components will work much better together than components from different manufacturers thrown together. Components made by Samsung  in the GS4 include:

  • Samsung N5VA101 Exynos 5 Applications Processor
  • Samsung KMV3W000LM-B310 NAND
  • Samsung K3QF2F200C-XGCE 2 GB DRAM
  • Samsung S2MPS11 Power Management IC

Galaxy-S4-handset Galaxy-S4-internal-02

All in all it appears the GS4 is internally primed to be the super phone it has been claimed to be and should live up to expectations. More details and more technical descriptions of what the S4 hold can be found on the Chipworks website.

[Chipworks]

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